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SHANGHAI ROYAL TECHENOLOGY INC.
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Electronic Circuit Board Copper Deposition Machine / Electronics Chips Magnetron Sputtering System

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Electronic Circuit Board Copper Deposition Machine / Electronics Chips Magnetron Sputtering System

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Brand Name : ROYAL

Model Number : DPC1215

Certification : CE certification

Place of Origin : Made in China

MOQ : 1 set

Price : negotiable

Payment Terms : L/C, D/A, D/P, T/T

Supply Ability : 6 sets per month

Delivery Time : 12 weeks

Packaging Details : Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.

Deposition Films : Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

Applications : Al2O3, AlN ceramic circuit boards, Al2O3 plates on LED, semiconductor

Film Features : better Thermal Conductivity, strong adhesion, high density, low production cost

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Electronics Cooper Sputtering System / Military electronics Chips Directly Plating Copper Sputtering Equipment


Cooper Magnetron Sputtering Coating Plant on Military electronics

The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate.

Cooper conductive film deposition on Al2O3, AlN, Si, Glass substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, the features:

1. Much lower production cost.

2. Outstanding thermal management and heat-transfer performance

3. Accurate alignment and pattern design,

4. High circuit density

5. Good adhesion and solderability


Royal technology team assisted our customer to developed the DPC process successfully with PVD sputtering technology.
Due to its advanced performance, the DPC substrates are widely used in various applications:

High brightness LED to increase the long life time because of its high heat radiation performance, Semiconductor equipment, microwave wireless communication, military electronics, various sensor substrates, aerospace, railway transportation, electricity power , etc


RTAC1215-SP equipment is exclusively designed for DPC process which get the cooper layer on substrates. This equipment utilizes PVD physical vapor deposition principle, with multi-arc ion plating and magnetron sputtering techniques to obtain the ideal film with high density, high abrasion resistance, high hardness and strong binding in high vacuum environment. It is the crucial step for rest DPC process.


Copper Sputtering Coating Machine Key Features


1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit.

2. Multilayer and co-deposition coating available

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

4. Ceramic/ Al2O3/AlN substrates heating up unit;

5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating.


Copper Sputtering Coating Machine Specifications


Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually


Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System


Copper Plating Samples



Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.


Download the brochure, please click here: Direct Plating Copper machine- DC and MF magnetro...


Product Tags:

small pvd coating machine

      

high vacuum coating machine

      
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